JPS63152238U - - Google Patents
Info
- Publication number
- JPS63152238U JPS63152238U JP4398487U JP4398487U JPS63152238U JP S63152238 U JPS63152238 U JP S63152238U JP 4398487 U JP4398487 U JP 4398487U JP 4398487 U JP4398487 U JP 4398487U JP S63152238 U JPS63152238 U JP S63152238U
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- injection port
- pot
- mold
- melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 18
- 230000008018 melting Effects 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 13
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims 6
- 239000004065 semiconductor Substances 0.000 claims 6
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987043984U JPH0537474Y2 (en]) | 1987-03-25 | 1987-03-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987043984U JPH0537474Y2 (en]) | 1987-03-25 | 1987-03-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63152238U true JPS63152238U (en]) | 1988-10-06 |
JPH0537474Y2 JPH0537474Y2 (en]) | 1993-09-22 |
Family
ID=30861364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987043984U Expired - Lifetime JPH0537474Y2 (en]) | 1987-03-25 | 1987-03-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0537474Y2 (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007533132A (ja) * | 2004-04-08 | 2007-11-15 | フィーコ ビー.ブイ. | 型空洞へ封入材料を供給するための方法およびデバイス |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5667240A (en) * | 1979-11-05 | 1981-06-06 | Shikoku Chem Corp | Method and device for molding thermosetting resin |
JPS5775435A (en) * | 1980-10-29 | 1982-05-12 | Mitsubishi Electric Corp | Liquid transfer molding |
-
1987
- 1987-03-25 JP JP1987043984U patent/JPH0537474Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5667240A (en) * | 1979-11-05 | 1981-06-06 | Shikoku Chem Corp | Method and device for molding thermosetting resin |
JPS5775435A (en) * | 1980-10-29 | 1982-05-12 | Mitsubishi Electric Corp | Liquid transfer molding |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007533132A (ja) * | 2004-04-08 | 2007-11-15 | フィーコ ビー.ブイ. | 型空洞へ封入材料を供給するための方法およびデバイス |
JP4819796B2 (ja) * | 2004-04-08 | 2011-11-24 | フィーコ ビー.ブイ. | 型空洞へ封入材料を供給するための方法およびデバイス |
Also Published As
Publication number | Publication date |
---|---|
JPH0537474Y2 (en]) | 1993-09-22 |
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